Semiconductor package having improved heat spreading...

Details Semiconductor package having improved heat spreading... Semiconductor package having improved heat spreading...

2011-07-05

2011-07-05

Matthews, Colleen A (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S706000, C257S717000, C257SE23101

Reexamination Certificate

active

07973400

ABSTRACT:
A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto, a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls.

REFERENCES:
patent: 2003/0197260 (2003-10-01), Nishimura et al.
patent: 2005/0199993 (2005-09-01), Lee et al.
patent: 2006/0006517 (2006-01-01), Lee et al.
patent: 08-017975 (1996-01-01), None
patent: 2001-085603 (2001-03-01), None
patent: 2002-176135 (2002-06-01), None
patent: 2005-0090882 (2005-09-01), None
patent: 2006-0080420 (2006-07-01), None
English language abstract of Japanese Publication No. 08-017975.
English language abstract of Japanese Publication No. 2001-085603.
English language abstract of Japanese Publication No. 2002-176135.
English language abstract of Korean Publication No. 2006-0080420.

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