Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-08-09
2011-08-09
Dang, Phuc T (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S108000, C438S127000, C257S666000, C257S678000
Reexamination Certificate
active
07993967
ABSTRACT:
A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.
REFERENCES:
patent: 5830800 (1998-11-01), Lin
patent: 6228753 (2001-05-01), Lo et al.
patent: 6555443 (2003-04-01), Artmann et al.
patent: 6562654 (2003-05-01), Kresge et al.
patent: 6710260 (2004-03-01), Seki et al.
patent: 6884652 (2005-04-01), Huang et al.
patent: 7485956 (2009-02-01), Tuckerman et al.
patent: 2005/0029110 (2005-02-01), Tang et al.
Hsiao Cheng-Hsu
Huang Chien-Ping
Jiang Yih-Jenn
Pu Han-Ping
Corless Peter F.
Dang Phuc T
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Siliconware Precision Industries Co., LTD.
LandOfFree
Semiconductor package fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package fabrication method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2762184