Semiconductor package and method of mounting semiconductor...

Details Semiconductor package and method of mounting semiconductor... Semiconductor package and method of mounting semiconductor...

2011-08-30

2011-08-30

Tran, Long K (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S051000, C438S055000, C438S108000, C438S109000, C438S110000, C438S112000, C438S127000, C257S127000

Reexamination Certificate

active

08008121

ABSTRACT:
A semiconductor package has a first conductive via formed through a substrate. The substrate with first conductive via is mounted to a first carrier. A first semiconductor die is mounted to a first surface of the substrate. A first encapsulant is deposited over the first die and first carrier. The first carrier is removed. The first die and substrate with the first encapsulant is mounted to a second carrier. A second semiconductor die is mounted to a second surface of the substrate opposite the first surface of the substrate. A second encapsulant is deposited over the second die. The second carrier is removed. A bump is formed over the second surface of the substrate. A conductive layer can be mounted over the first die. A second conductive via can be formed through the first encapsulant and electrically connected to the first conductive via. The semiconductor packages are stackable.

REFERENCES:
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patent: 6137164 (2000-10-01), Yew et al.
patent: 6753205 (2004-06-01), Halahan
patent: 6774473 (2004-08-01), Shen
patent: 7170158 (2007-01-01), Choi et al.
patent: 2008/0128882 (2008-06-01), Baek et al.
patent: 2009/0166837 (2009-07-01), Webster et al.

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