Semiconductor package and method of making the same

Details Semiconductor package and method of making the same Semiconductor package and method of making the same

2011-05-24

2011-05-24

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S777000, C257S686000, C257S774000, C257SE23145

Reexamination Certificate

active

07948095

ABSTRACT:
The present invention relates to semiconductor devices comprising two or more dies stacked vertically on top of one another, and methods of making the semiconductor devices. The methods may comprise a combination of wafer-level through silicon interconnect fabrication and wafer-level assembly processes.

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