Semiconductor package and method of forming Z-direction...

Details Semiconductor package and method of forming Z-direction... Semiconductor package and method of forming Z-direction...

2011-08-09

2011-08-09

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C257S786000, C257S690000, C257S701000, C257S713000

Reexamination Certificate

active

07993941

ABSTRACT:
A semiconductor package is made using a prefabricated post carrier including a base plate and plurality of conductive posts. A film encapsulant is disposed over the base plate of the post carrier and around the conductive posts. A semiconductor die is mounted to a temporary carrier. The post carrier and temporary carrier are pressed together to embed the semiconductor die in the film encapsulant. The semiconductor die is disposed between the conductive posts in the film encapsulant. The temporary carrier and base plate of the post carrier are removed. A first circuit build-up layer is formed over a first side of the film encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. A second circuit build-up layer is formed over a second side of the film encapsulant opposite the first side. The second circuit build-up layer is electrically connected to the conductive posts.

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