Semiconductor package and method of forming wire loop of...

Details Semiconductor package and method of forming wire loop of... Semiconductor package and method of forming wire loop of...

2007-07-09

2009-06-16

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE23024, C228S180500

Reexamination Certificate

active

07547626

ABSTRACT:
Provided are a semiconductor package and a method of forming a wire loop of the semiconductor package. The semiconductor package includes: at least one semiconductor chip; a lead frame including a plurality of leads; and a plurality of wire loops, the wire loops connecting an electrode pad of the semiconductor chip to the leads. Wire loops include: a ball connected to the electrode pad; a pressed part formed on an upper surface of the ball by pressing the wire to overlap two parts of the wire; a first wire part extending substantially horizontally from the pressed part and including at least a portion contacting an upper surface of the semiconductor chip; a second wire part extending at a downward incline from the first wire part; and a third wire part extending from the second wire part and including an end connected to one of the leads.

REFERENCES:
patent: 6222274 (2001-04-01), Nishiura et al.
patent: 6391759 (2002-05-01), Chao et al.
patent: 6933608 (2005-08-01), Fujisawa
patent: 2002/0056924 (2002-05-01), Chung et al.

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