Semiconductor package

Details Semiconductor package Semiconductor package

2006-12-12

2006-12-12

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S013000, C257S021000, C257S079000, C257S082000, C257S323000, C257S414000, C257S431000, C257S432000, C257S778000, C257S782000, C257S784000

Reexamination Certificate

active

07148529

ABSTRACT:
A semiconductor package includes (a) an interposer, (b) a wiring layer containing conductors formed adjacent to each other at intervals that cause no short circuit among the conductors, the wiring layer covering a given area of the interposer, to block light from passing through the given area, (c) a light blocking layer covering a no-wiring area of the interposer not covered by the wiring layer, to block light from passing through the no-wiring area, (d) a semiconductor chip electrically connected to the wiring layer, and (e) a resin mold sealing the wiring layer, the light blocking layer, and the semiconductor chip.

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