Semiconductor package

Details Semiconductor package Semiconductor package

2008-05-20

2008-05-20

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With housing mount

C257S773000, C257S776000, C257S780000, C257S784000, C257S678000, C361S638000, C361S640000, C361S727000, C361S736000, C361S749000

Reexamination Certificate

active

07375426

ABSTRACT:
A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.

REFERENCES:
patent: 4868638 (1989-09-01), Hirata et al.
patent: 5103292 (1992-04-01), Mahulikar
patent: 5561323 (1996-10-01), Andros et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 6097603 (2000-08-01), Edwards et al.
patent: 6809931 (2004-10-01), Dove et al.
patent: 6906414 (2005-06-01), Zhao et al.
patent: 2003/0193080 (2003-10-01), Cabahug et al.
patent: 1349256 (2002-05-01), None
patent: 1999-025075 (1999-04-01), None
patent: 2000-19591 (2000-04-01), None
patent: 2002-0089785 (2002-11-01), None
patent: WO 02/50899 (2002-06-01), None
English language abstract of Korean Publication No. 2002-0089785.

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