Semiconductor multi-package module having package stacked...

Details Semiconductor multi-package module having package stacked... Semiconductor multi-package module having package stacked...

2007-03-09

2009-12-29

Menz, Douglas M (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000

Reexamination Certificate

active

07638363

ABSTRACT:
A semiconductor multi-package module having a second package stacked over a lower ball grid array first package, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a ball grid array first package including a substrate and a die, affixing a second package including a substrate and a die onto an upper surface of the lower package, and forming z-interconnects between the first and lower substrates.

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