Semiconductor multi-chip package including two semiconductor...

Details Semiconductor multi-chip package including two semiconductor... Semiconductor multi-chip package including two semiconductor...

2006-08-23

2009-02-03

Nguyen, Van Thu (Department: 2824)

Static information storage and retrieval

Format or disposition of elements

C365S189200, C365S191000, C365S230060

Reexamination Certificate

active

07486532

ABSTRACT:
A semiconductor multi-chip package includes: a first semiconductor memory chip having n address pads, a first control pad, and a first address controller; and a second semiconductor memory chip whose memory density is greater, e.g., at least 1.5 times greater, than the first semiconductor memory chip and which is disposed on the first semiconductor memory chip, and has (n+1) address pads, a second control pad, and a second address controller. The n address pads of the first semiconductor memory chip and the n address pads of the second semiconductor memory chip are respectively connected to corresponding n address pins. The first and second control pads are connected to a control pin. The first and second address controllers are operable in a mutually exclusive manner, e.g., manner of activation, according to a signal applied to the control pin.

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