Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2006-04-25
2006-04-25
Everhart, Caridad (Department: 2891)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
C438S769000, C438S762000
Reexamination Certificate
active
07033956
ABSTRACT:
Methods for making memory devices are disclosed for forming germanium nanocrystals in an oxynitride layer. The method includes: forming a first dielectric layer over a substrate; forming an oxynitride layer containing germanium nanocrystals over the first dielectric layer; forming a second dielectric layer over the oxynitride layer; forming a gate over the second dielectric layer; and providing source, drain, and channel regions in the substrate. In one example, the channel region is positioned to correspond to at least a portion of the gate.
REFERENCES:
patent: 5241214 (1993-08-01), Herbots et al.
patent: 5783498 (1998-07-01), Dotta
patent: 6656792 (2003-12-01), Choi et al.
patent: 6746943 (2004-06-01), Takayanagi et al.
patent: 2005/0098822 (2005-05-01), Mathew et al.
patent: 2005/0142769 (2005-06-01), Kamata et al.
Tiwari, et al., “Volatile and Non-Volatile Memories in Silicon with Nano-Crystal Storage”, IEEE 1995, IEDM 95-521, pp. 20.4.1-20.4.4, Yorktown Heights, NY.
Hanafi, et al., “Fast and Long Retention-Time Nano-Crystal Memory”, IEEE Transactions on Electron Devices, vol. 43, No. 9, Sep. 1996, pp. 1553-1558, Yorktown Heights, NY.
Zacharias, et al., “A Comparative Study of Ge Nanocrystals in Six, GeyOz alloys and SiOx/GeOy Multilayers”, J. Appl. Phys. 81 (5), Mar. 1997, American Institute of Physics, 1997, pp. 2384-2390, Poughkeepsie, NY.
Steimle, et al., “Hybrid Silicon Nanocrystal Silicon Nitride Dynamic Random Access Memory”, IEEE Transactions on Nanotechnology, vol. 2, No. 4, Dec. 2003, pp. 335-340, Austin, TX.
Takata, et al., “New Non-Volatile Memory with Extremely High Density Metal Nano-Dots”, IEEE 2003, IEDM 03-553, pp. 22.5.1-22.5.2, Japan.
King, et al., “Charge-Trap Memory Device Fabricated by Oxidation of Si1-xGeX”, IEEE Transactions on Electron Devices, vol. 48, No. 4, pp. 696-700, Berkeley, CA.
Everhart Caridad
Gump Akin
ProMOS Technologies Inc.
Strauss Hauer & Feld, LLP
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