Semiconductor memory device with a multi-bank structure

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Reexamination Certificate

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C365S193000

Reexamination Certificate

active

06172931

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a semiconductor memory device, and more particularly to a voltage boosting circuit of a semiconductor memory device.
BACKGROUND OF THE INVENTION
In a semiconductor memory device such as a dynamic RAM (random access memory), the transmission a data signal can shift of an effective voltage potential of the data signal. In a dynamic RAM including CMOS transistors, a voltage drop about equal to the threshold voltage of the MOS transistor occurs when transmitting a signal through the MOS transistor. This inevitable voltage drop becomes an obstacle to the accurate reading or writing of data and potentially could cause the loss of data. To solve this problem, a voltage boosting circuit can raise a voltage level to compensate for a voltage drop. U.S. Pat. No. 5,610,549 entitled “
VOLTAGE BOOSTING CIRCUIT OF A SEMICONDUCTOR MEMORY CIRCUIT
”, and U.S. Pat. No. 5,521,546 entitled “
VOLTAGE BOOSTING CIRCUIT CONSTRUCTED ON AN INTEGRATED CIRCUIT SUBSTRATE, AS FOR A SEMICONDUCTOR MEMORY DEVICE
” describe known voltage boosting circuits and are hereby incorporated by reference in their entirety.
FIG. 1
is a block diagram of a known dynamic RAM device
10
that includes eight banks (or cell array banks). Although not shown in
FIG. 1
, each bank
12
includes circuits for selecting rows and columns (for example, a row decoder circuit and a column decoder circuit), a sense amplifier circuit, a column pass gate circuit, and a data input/output buffer circuit. Each bank
12
also has a respective voltage boosting circuit
14
having a structure such as those disclosed in U.S. Pat. No. 5,610,549 or 5,521,546 patent. Banks
12
connect to a common line L
1
. When banks
12
are selected (or activated), the corresponding voltage boosting circuits
14
supply the selected banks
12
with a high voltage Vpp (having a voltage level higher than a power supply voltage level). An active signal BANKi indicates the activation of the bank i.
Dynamic RAM devices having larger storage capacity tend to have more banks. In the dynamic RAM devices having a multi-bank structure, circuitry required for voltage boosting circuits
14
, which are selected in accordance with activation information for the respective banks
12
, increases the required chip area. As a result, chip efficiency (an occupied area by the banks of a chip area) is lowered because the number of voltage boosting circuits
14
corresponds to the number of banks
12
.
SUMMARY OF THE INVENTION
According to an aspect of the present invention, a semiconductor memory device with multi-bank structure includes voltage boosting circuits (or internal power supply voltage generating circuits) and a select signal generating circuit that controls sequential selection of respective voltage boosting circuits (or internal power supply voltage generating circuits). The select signal generating circuit uses a row address strobe signal in generating select signals corresponding to the voltage boosting circuits. A voltage boosting circuit (or internal power supply voltage generating circuit) thus selected generates a high voltage (or an internal power supply voltage) to be provided to a bank which is selected in accordance with the row address strobe signal.
According to the above-mentioned configuration, the number of the voltage boosting circuits (or internal power supply voltage generating circuits) is less than the number of banks in the memory device. With larger storage capacity memory devices, the area that the voltage boosting circuits (or internal power supply voltage generating circuits) occupy on a chip is a smaller proportion of the total chip area.


REFERENCES:
patent: 5659519 (1997-08-01), Lee et al.
patent: 5774399 (1998-06-01), Kwon
patent: 5862096 (1999-01-01), Yasuda et al.
patent: 6038178 (2000-03-01), Oh

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