Semiconductor memory device for stack package and read data...

Details Semiconductor memory device for stack package and read data... Semiconductor memory device for stack package and read data...

2007-05-10

2008-12-02

Nguyen, Tan T. (Department: 2827)

Static information storage and retrieval

Read/write circuit

Signals

C365S233100

Reexamination Certificate

active

07460418

ABSTRACT:
A semiconductor memory device and a read data skew control method thereof, in which a point of time when read data is output can he controlled using pad bonding in stack packages. The semiconductor memory device includes a bonding option pad and a delay control circuit that controls the point of time when data is output from an output buffer depending on logic states of a signal applied to the bonding option pad. Thus, when using the semiconductor memory device in stack packages, the read data skew generated as a result of a load on a bonding wire can be compensated by connecting the bonding option pad to ground voltage or a supply voltage.

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patent: 6388945 (2002-05-01), Aikawa
patent: 6778448 (2004-08-01), Kurosaki
patent: 1020020039210 (2002-05-01), None
patent: 1020030023341 (2003-03-01), None

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