Semiconductor memory device and method of manufacturing the...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S594000, C438S261000, C438S211000

Reexamination Certificate

active

07927949

ABSTRACT:
A semiconductor memory device manufacturing method includes forming a floating gate electrode above a semiconductor substrate, forming an interelectrode insulating film above the floating gate electrode, forming a first radical nitride film on a surface of the interelectrode insulating film by first radical nitriding, and forming a control gate electrode on the first radical nitride film.

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“Notice of Reasons for Rejection” mailed Aug. 24, 2010, from the Japanese Patent Office in corresponding JP Application No. 2005-128232, and English language translation thereof.

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