Semiconductor manufacturing apparatus and manufacturing...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means

Reexamination Certificate

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Details

C156S345430, C156S345470, C118S7230AN, C118S7230ER, C118S7230ER

Reexamination Certificate

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08007632

ABSTRACT:
A semiconductor manufacturing apparatus includes a chamber, a gas supplier, a vacuum pump, an electrode, a conductive knitted wire mesh and a radio frequency power supply. The electrode is placed outside of the chamber and fixed to the chamber. The gas supplier supplies gas into the chamber. The vacuum pump exhausts the chamber. The radio frequency power supply supplies radio frequency power to the electrode through the conductive knitted wire mesh.

REFERENCES:
patent: 5846329 (1998-12-01), Hori et al.
patent: 5922134 (1999-07-01), Ohbuchi
patent: 7-37870 (1995-02-01), None
patent: 10-144495 (1998-05-01), None

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