Semiconductor integrated circuit device, method for producing or

Details Semiconductor integrated circuit device, method for producing or Semiconductor integrated circuit device, method for producing or

1989-08-16

1991-07-16

Heinrich, Sam

Metal fusion bonding

Process

Using high frequency vibratory energy

228111, 228219, 228179, H01L 21607, B23K 2010

Patent

active

050318217

ABSTRACT:
The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the capillary to a second bonding point while delivering the wire after ball bonding at a first bonding point.

REFERENCES:
patent: 3912900 (1975-10-01), Arnett
patent: 4040885 (1977-08-01), Hight et al.
patent: 4564734 (1986-01-01), Okikawa
patent: 4580713 (1986-04-01), Sekibata et al.
patent: 4597522 (1986-07-01), Kobayashi

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