Semiconductor integrated circuit device manufacturing method

Details Semiconductor integrated circuit device manufacturing method Semiconductor integrated circuit device manufacturing method

2007-10-23

2007-10-23

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S199000, C438S014000, C257S369000, C257SE21177

Reexamination Certificate

active

11402862

ABSTRACT:
To reduce variation in channel lengths of MOS transistors within a circuit functional module. When exposure of a wafer substrate having a semiconductor integrated circuit device1including a plurality of CMOS circuit module regions CCM11to CCM22to be subject to substrate bias control formed in a core region10is performed using a step-and-scan type projection exposure apparatus, scanning is performed in the same direction as a longitudinal direction of the respective CMOS circuit module regions CCM11to CCM22. In this device, a gate insulating film is formed on the substrate, a gate electrode material film is formed on the gate insulating film, and a photoresist film is formed on the gate electrode material film.

REFERENCES:
patent: 6064097 (2000-05-01), Hiraga
patent: 6090510 (2000-07-01), Tokuda
patent: 6475862 (2002-11-01), Ando
patent: 6912697 (2005-06-01), Shibata et al.
patent: 2005/0001270 (2005-01-01), Esmark et al.
patent: 2001-156261 (2001-06-01), None
patent: 2004-165649 (2004-06-01), None
patent: 2004-228417 (2004-08-01), None

Affiliated with

Also associated with

Rating

Semiconductor integrated circuit device manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor integrated circuit device manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit device manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3902952