Semiconductor imaging device and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S433000, C257S434000, C257S680000, C257SE31117, C257SE31127

Reexamination Certificate

active

07547955

ABSTRACT:
A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.

REFERENCES:
patent: 6556349 (2003-04-01), Cox et al.
patent: 6583438 (2003-06-01), Uchida
patent: 2002/0163054 (2002-11-01), Suda
patent: 9-260624 (1997-10-01), None
patent: 2003-244558 (2003-08-01), None

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