Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate
2006-12-01
2010-10-19
Lee, Eugene (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
C257S692000, C257S698000, C257SE23037
Reexamination Certificate
active
07816777
ABSTRACT:
A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.
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Fukuda Toshiyuki
Itou Kenichi
Minamio Masanori
Sakota Hideki
Takeuchi Noboru
Lee Eugene
McDermott Will & Emery LLP
Panasonic Corporation
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