Semiconductor die singulation method

Details Semiconductor die singulation method Semiconductor die singulation method

2011-08-02

2011-08-02

Smith, Matthew (Department: 2895)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S113000, C438S114000, C438S460000, C438S700000, C438S704000, C438S710000, C438S745000

Reexamination Certificate

active

07989319

ABSTRACT:
In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer.

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