Semiconductor devices and methods of manufacturing such...

Details Semiconductor devices and methods of manufacturing such... Semiconductor devices and methods of manufacturing such...

2006-09-05

2006-09-05

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S672000, C438S687000

Reexamination Certificate

active

07101788

ABSTRACT:
A method of manufacturing a semiconductor device includes the steps of providing a semiconductor substrate (102), forming a dielectric layer (104) over the semiconductor substrate (102), and etching a trench structure (106) or a via structure (106) in the dielectric layer (104) to expose a portion of a surface of the semiconductor substrate (102). The method also includes the steps of treating a surface (104a) of the dielectric layer (104) with an adhesion solution, such as a reactive plasma including hydrogen, and forming a diffusion barrier layer (110) over the dielectric layer (104). Moreover, the adhesion solution chemically interacts with the surface (104a) of the dielectric layer (104) and enhances or increases adhesion between dielectric layer (104) and diffusion barrier layer (110).

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