Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-09-13
2005-09-13
Schillinger, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S239000, C438S200000
Reexamination Certificate
active
06943079
ABSTRACT:
Certain embodiments of the present invention relate to a method for manufacturing a semiconductor device, in which, when a cell capacitor of a DRAM and a capacitor element in an analog element region are mix-mounted on the same chip, the manufacturing steps can be simplified. First, the lower electrodes55aand55bof the capacitor elements600aand600b,and the storage nodes53aand53bof the cell capacitors700aand700bare simultaneously formed. Next, a dielectric layer (ON layer61) of the capacitor elements600aand600b,and a dielectric layer (ON layer61) of the cell capacitors700aand700bare simultaneously formed. Then, the upper electrodes69aand69bof the capacitor elements600aand600band the cell plate67of the cell capacitors700aand700bare simultaneously formed.
REFERENCES:
patent: 4598460 (1986-07-01), Owens et al.
patent: 5356826 (1994-10-01), Natsume
patent: 5420449 (1995-05-01), Oji
patent: 5489547 (1996-02-01), Erdeljac et al.
patent: 5539229 (1996-07-01), Noble, Jr et al.
patent: 5747385 (1998-05-01), Torii
patent: 5928959 (1999-07-01), Huckels et al.
patent: 5930618 (1999-07-01), Sun et al.
patent: 5994730 (1999-11-01), Shrivastava et al.
patent: 6010931 (2000-01-01), Sun et al.
patent: 6022781 (2000-02-01), Noble, Jr. et al.
patent: 6025620 (2000-02-01), Kimura et al.
patent: 6040596 (2000-03-01), Choi et al.
patent: 6074908 (2000-06-01), Huang
patent: 6077742 (2000-06-01), Chen et al.
patent: 6104053 (2000-08-01), Nagai
patent: 6110772 (2000-08-01), Takada et al.
patent: 6137179 (2000-10-01), Huang
patent: 6204105 (2001-03-01), Jung
patent: 6215142 (2001-04-01), Lee et al.
patent: 6242296 (2001-06-01), Sun
patent: 6262446 (2001-07-01), Koo et al.
patent: 6291847 (2001-09-01), Ohyu et al.
patent: 6303432 (2001-10-01), Horita et al.
patent: 6353269 (2002-03-01), Huang
patent: 6384444 (2002-05-01), Sakoh
patent: 6404001 (2002-06-01), Koo et al.
patent: 2001/0005610 (2001-06-01), Fukase et al.
patent: 2001/0013632 (2001-08-01), Richiuso
patent: 2001/0031528 (2001-10-01), Tsugane et al.
patent: 2001/0031532 (2001-10-01), Tsugane et al.
patent: 2001/0032993 (2001-10-01), Tsugane et al.
patent: 2002/0025678 (2002-02-01), Chen et al.
patent: 09-116113 (1997-05-01), None
patent: 09-232531 (1997-09-01), None
patent: 09-260607 (1997-10-01), None
patent: 09-321242 (1997-12-01), None
patent: 10-083067 (1998-03-01), None
patent: 10-284702 (1998-10-01), None
patent: 11-074487 (1999-03-01), None
patent: 11-150248 (1999-06-01), None
patent: 11-214656 (1999-08-01), None
patent: 11-317503 (1999-11-01), None
patent: 11-330272 (1999-11-01), None
patent: 11-340433 (1999-12-01), None
patent: 2000-196037 (2000-07-01), None
U.S. Appl. No. 09/742,474, filed Dec. 22, 2000.
U.S. Appl. No. 09/915,660, filed Jul. 26, 2001 (Div of U.S. Appl. No. 09/484,786, filed Jan. 18, 2000).
Notice of Reasons of Rejection for Japanese Patent Application No. 2000-005042 (priority for U.S. Appl. No. 09/759,665) dated Jun. 17, 2003 (which lists 09-260607, 09-116113, 10-083867 and 2000-196037 cited above).
Notice of Reasons of Rejection for Japanese Patent Application No. 2000-005336 dated Jun. 17, 2003 (which lists 09-232531, 11-150248, 11-317503 cited above).
Notice of Reasons of Rejection for Japanese Patent Application No. 2000-005335 dated Jun. 17, 2003 (which lists the eight Japanese documents cited above).
U.S Appl. No. 09/759,665, filed Jan. 13, 2001, and pending claims.
U.S. Appl. No. 09/759,915, filed Jan. 13, 2001, and pending claims.
U.S. Appl. No. 09/759,715, filed Jan. 13, 2001, and pending claims.
Sato Hisakatsu
Tsugane Hiroaki
Konrad Raynes & Victor LLP
Raynes Alan S.
Schillinger Laura M
Seiko Epson Corp.
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