Semiconductor devices and methods for manufacturing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S239000, C438S200000

Reexamination Certificate

active

06943079

ABSTRACT:
Certain embodiments of the present invention relate to a method for manufacturing a semiconductor device, in which, when a cell capacitor of a DRAM and a capacitor element in an analog element region are mix-mounted on the same chip, the manufacturing steps can be simplified. First, the lower electrodes55aand55bof the capacitor elements600aand600b,and the storage nodes53aand53bof the cell capacitors700aand700bare simultaneously formed. Next, a dielectric layer (ON layer61) of the capacitor elements600aand600b,and a dielectric layer (ON layer61) of the cell capacitors700aand700bare simultaneously formed. Then, the upper electrodes69aand69bof the capacitor elements600aand600band the cell plate67of the cell capacitors700aand700bare simultaneously formed.

REFERENCES:
patent: 4598460 (1986-07-01), Owens et al.
patent: 5356826 (1994-10-01), Natsume
patent: 5420449 (1995-05-01), Oji
patent: 5489547 (1996-02-01), Erdeljac et al.
patent: 5539229 (1996-07-01), Noble, Jr et al.
patent: 5747385 (1998-05-01), Torii
patent: 5928959 (1999-07-01), Huckels et al.
patent: 5930618 (1999-07-01), Sun et al.
patent: 5994730 (1999-11-01), Shrivastava et al.
patent: 6010931 (2000-01-01), Sun et al.
patent: 6022781 (2000-02-01), Noble, Jr. et al.
patent: 6025620 (2000-02-01), Kimura et al.
patent: 6040596 (2000-03-01), Choi et al.
patent: 6074908 (2000-06-01), Huang
patent: 6077742 (2000-06-01), Chen et al.
patent: 6104053 (2000-08-01), Nagai
patent: 6110772 (2000-08-01), Takada et al.
patent: 6137179 (2000-10-01), Huang
patent: 6204105 (2001-03-01), Jung
patent: 6215142 (2001-04-01), Lee et al.
patent: 6242296 (2001-06-01), Sun
patent: 6262446 (2001-07-01), Koo et al.
patent: 6291847 (2001-09-01), Ohyu et al.
patent: 6303432 (2001-10-01), Horita et al.
patent: 6353269 (2002-03-01), Huang
patent: 6384444 (2002-05-01), Sakoh
patent: 6404001 (2002-06-01), Koo et al.
patent: 2001/0005610 (2001-06-01), Fukase et al.
patent: 2001/0013632 (2001-08-01), Richiuso
patent: 2001/0031528 (2001-10-01), Tsugane et al.
patent: 2001/0031532 (2001-10-01), Tsugane et al.
patent: 2001/0032993 (2001-10-01), Tsugane et al.
patent: 2002/0025678 (2002-02-01), Chen et al.
patent: 09-116113 (1997-05-01), None
patent: 09-232531 (1997-09-01), None
patent: 09-260607 (1997-10-01), None
patent: 09-321242 (1997-12-01), None
patent: 10-083067 (1998-03-01), None
patent: 10-284702 (1998-10-01), None
patent: 11-074487 (1999-03-01), None
patent: 11-150248 (1999-06-01), None
patent: 11-214656 (1999-08-01), None
patent: 11-317503 (1999-11-01), None
patent: 11-330272 (1999-11-01), None
patent: 11-340433 (1999-12-01), None
patent: 2000-196037 (2000-07-01), None
U.S. Appl. No. 09/742,474, filed Dec. 22, 2000.
U.S. Appl. No. 09/915,660, filed Jul. 26, 2001 (Div of U.S. Appl. No. 09/484,786, filed Jan. 18, 2000).
Notice of Reasons of Rejection for Japanese Patent Application No. 2000-005042 (priority for U.S. Appl. No. 09/759,665) dated Jun. 17, 2003 (which lists 09-260607, 09-116113, 10-083867 and 2000-196037 cited above).
Notice of Reasons of Rejection for Japanese Patent Application No. 2000-005336 dated Jun. 17, 2003 (which lists 09-232531, 11-150248, 11-317503 cited above).
Notice of Reasons of Rejection for Japanese Patent Application No. 2000-005335 dated Jun. 17, 2003 (which lists the eight Japanese documents cited above).
U.S Appl. No. 09/759,665, filed Jan. 13, 2001, and pending claims.
U.S. Appl. No. 09/759,915, filed Jan. 13, 2001, and pending claims.
U.S. Appl. No. 09/759,715, filed Jan. 13, 2001, and pending claims.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor devices and methods for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor devices and methods for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor devices and methods for manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3437331

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.