Semiconductor devices and method for manufacturing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S172000, C257S097000, C257S103000, C257S194000

Reexamination Certificate

active

06844227

ABSTRACT:
In a field effect transistor, an Si layer, an SiC (Si1-yCy) channel layer, a CN gate insulating film made of a carbon nitride layer (CN) and a gate electrode are deposited in this order on an Si substrate. The thickness of the SiC channel layer is set to a value that is less than or equal to the critical thickness so that a dislocation due to a strain does not occur according to the carbon content. A source region and a drain region are formed on opposite sides of the SiC channel layer, and a source electrode and a drain electrode are provided on the source region and the drain region, respectively.

REFERENCES:
patent: 5561302 (1996-10-01), Candelaria
patent: 6190975 (2001-02-01), Kubo et al.
patent: 6323525 (2001-11-01), Noguchi et al.
patent: 6472685 (2002-10-01), Takagi
patent: 494395 (1992-07-01), None
patent: 921575 (1999-06-01), None
patent: 04-247664 (1992-09-01), None
patent: 5-218014 (1993-08-01), None
patent: 07-321222 (1995-12-01), None
patent: 9-82944 (1997-03-01), None
patent: 10-214906 (1998-08-01), None
patent: 11-233771 (1999-08-01), None
patent: 2000-114257 (2000-04-01), None
patent: 2000-150512 (2000-05-01), None
patent: 2000-216163 (2000-08-01), None
patent: 2000-216392 (2000-08-01), None
patent: 2000-277514 (2000-10-01), None
patent: 2000-286413 (2000-10-01), None
patent: 2000-286418 (2000-10-01), None
patent: WO 0060671 (2000-10-01), None
M. Togo et al., “Low-Leakage and Highly-Reliable 1.5 nm SiON Gate-Dielectric Using Radical Oxynitridation for Sub-0.1 μm CMOS”, 2000 Symposium on VLSI Technology Digest of Tchnical Papers.

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