Semiconductor device with test terminal and IC socket

Details Semiconductor device with test terminal and IC socket Semiconductor device with test terminal and IC socket

1998-02-25

1999-08-03

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257737, 324755, 361767, 439 66, 438 18, H01L 2358

Patent

active

059328916

ABSTRACT:
A plurality of solder balls are arranged at a main surface of a BGA type semiconductor device. A test terminal is provided on the main surface adjacent to the solder ball. A contact pin of an IC socket is abutted against this test terminal. Accordingly, favorable electrical connection between a contact pin and a protruding external electrode can be achieved while suppressing deformation of the external electrode in testing a semiconductor device prior to mounting.

REFERENCES:
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 5418471 (1995-05-01), Kardos
patent: 5646442 (1997-07-01), Abe et al.
patent: 5844317 (1998-12-01), Bertolet et la.

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