Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-07-11
2000-02-01
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257667, 257701, H01L 2348
Patent
active
060206454
ABSTRACT:
A semiconductor device includes a substrate, a semiconductor chip having a lower surface mounted to the substrate, an upper surface and side surfaces, and a frame mounted to the substrate and surrounding the side surfaces of the semiconductor chip. A bonding material is provided between the upper surface of the semiconductor chip and an upper edge of the frame, the bonding material being provided along at least the entire upper surface edges of the semiconductor chip along the entire peripheral edge and the upper edge of the frame for sealing at least the area between the sides of the semiconductor chip and the frame.
REFERENCES:
patent: 5737191 (1998-04-01), Horiuchi et al.
patent: 5844316 (1998-12-01), Gamota et al.
Jr. Carl Whitehead
Potter Roy
Ricoh & Company, Ltd.
LandOfFree
Semiconductor device with semiconductor chip bonded face down on does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device with semiconductor chip bonded face down on, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with semiconductor chip bonded face down on will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-939715