Semiconductor device with semiconductor chip bonded face down on

Details Semiconductor device with semiconductor chip bonded face down on Semiconductor device with semiconductor chip bonded face down on

1997-07-11

2000-02-01

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257667, 257701, H01L 2348

Patent

active

060206454

ABSTRACT:
A semiconductor device includes a substrate, a semiconductor chip having a lower surface mounted to the substrate, an upper surface and side surfaces, and a frame mounted to the substrate and surrounding the side surfaces of the semiconductor chip. A bonding material is provided between the upper surface of the semiconductor chip and an upper edge of the frame, the bonding material being provided along at least the entire upper surface edges of the semiconductor chip along the entire peripheral edge and the upper edge of the frame for sealing at least the area between the sides of the semiconductor chip and the frame.

REFERENCES:
patent: 5737191 (1998-04-01), Horiuchi et al.
patent: 5844316 (1998-12-01), Gamota et al.

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