Semiconductor device with semiconductor chip and adhesive...

Details Semiconductor device with semiconductor chip and adhesive... Semiconductor device with semiconductor chip and adhesive...

2006-10-06

2008-12-30

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S113000, C438S464000, C257S620000, C257SE21523

Reexamination Certificate

active

07470601

ABSTRACT:
A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.

REFERENCES:
patent: 7205211 (2007-04-01), Aspar et al.
patent: 7294521 (2007-11-01), Yoo
patent: 2008/0003720 (2008-01-01), Lu et al.
patent: 102004054147 (2006-02-01), None
patent: 2404280 (2005-01-01), None
patent: 2004193241 AA (2004-07-01), None
patent: WO 2005/083779 (2005-09-01), None

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