Semiconductor device with selectable gate thickness and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S197000, C438S532000, C438S585000, C438S588000, C257S412000, C257SE21638, C257SE21632, C257SE21316

Reexamination Certificate

active

06855605

ABSTRACT:
A method of forming layers, in the same device material, with different thickness or layer height in a semiconductor device comprises forming device material layer or gate electrode layer disposable parts in selected regions of the device layer. The disposable parts can be formed by doping the selected regions to the desired depth d. The as-deposited thickness t of this device layer can be adjusted or modulated after the patterning of the individual devices by removing the disposable parts.

REFERENCES:
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patent: 5021354 (1991-06-01), Pfiester
patent: 5963803 (1999-10-01), Dawson et al.
patent: 6033944 (2000-03-01), Shida
patent: 6080629 (2000-06-01), Gardner et al.
patent: 6166413 (2000-12-01), Ono
patent: 6171897 (2001-01-01), Takenaka
patent: 6294460 (2001-09-01), Subramanian et al.
patent: 6348405 (2002-02-01), Ohuchi
patent: 2 346 261 (2000-08-01), None
patent: 2000058668 (2000-02-01), None
European Search Report for European Application No. EP 01204564.7, filed Nov. 26, 2001.

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