Semiconductor device with contacting electrodes

Details Semiconductor device with contacting electrodes Semiconductor device with contacting electrodes

2005-07-19

2005-07-19

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S668000, C257S778000, C257S790000, C257S737000, C257S738000

Reexamination Certificate

active

06919646

ABSTRACT:
A semiconductor device in which a semiconductor element and a substrate are disposed face-to-face is obtained by: providing a sealing resin, which is a mixture of a thermoplastic resin and a thermosetting resin, between the semiconductor element and the substrate; heating at a temperature greater than a melting temperature of the thermoplastic resin; applying pressure to the sealing resin so that it spreads through the space between the semiconductor element and the substrate; melt-bonding the semiconductor element and the substrate through a cooling contraction of the thermoplastic resin component; and heating at a temperature less than a melt bond temperature of the thermoplastic resin component to cure the thermosetting resin component.

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