Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Recessed oxide by localized oxidation
Reexamination Certificate
2011-01-04
2011-01-04
Jackson, Jr., Jerome (Department: 2815)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Recessed oxide by localized oxidation
C257SE21102
Reexamination Certificate
active
07863152
ABSTRACT:
A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect.
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Choi Hyun-min
Lee Seung-Hwan
Maeda Shigenobu
Shin Heon-Jong
WangXiao Quan
Budd Paul A
Jackson, Jr. Jerome
Mills & Onello LLP
Samsung Electronics Co,. Ltd.
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