Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-01-03
2006-01-03
Thai, Luan (Department: 2829)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S123000
Reexamination Certificate
active
06982220
ABSTRACT:
An integrated circuit power distribution system and method is provided. The integrated circuit comprises a semiconductor die that includes at least one pair of bond pads having a single bond wire connected thereto such that each bond pad of the pair of bond pads has only one bond wire end connected thereto. A first bond pad of the pair of bond pads is located in an internal portion of the semiconductor die. A first wire having a first end and a second end is electrically connected between the pair of bond pads.
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Marvell International LTD.
Thai Luan
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