Semiconductor device package, semiconductor apparatus, and...

Details Semiconductor device package, semiconductor apparatus, and... Semiconductor device package, semiconductor apparatus, and...

2011-03-01

2011-03-01

Fulk, Steven J (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21597, C257S621000

Reexamination Certificate

active

07897510

ABSTRACT:
A method for manufacturing a package which includes: an etching step of etching a silicon substrate, and forming a via hole penetrating through the silicon substrate; and a step of embedding an electrically conductive material in the via hole, and forming a via plug, characterized in that the etching step includes a first etching step of forming the via hole in a straight shape, and a second etching step of forming the via hole in a taper shape.

REFERENCES:
patent: 6400172 (2002-06-01), Akram et al.
patent: 6787916 (2004-09-01), Halahan
patent: 7098070 (2006-08-01), Chen et al.
patent: 2002/0151171 (2002-10-01), Furusawa
patent: 2003/0119308 (2003-06-01), Geefay et al.
patent: 2005/0266687 (2005-12-01), Morimoto
patent: 2006/0040494 (2006-02-01), Hiatt
patent: 2005-019609 (2005-01-01), None
patent: 2005-327820 (2005-11-01), None
patent: WO 2006/004127 (2006-01-01), None

Affiliated with

Also associated with

Rating

Semiconductor device package, semiconductor apparatus, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device package, semiconductor apparatus, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device package, semiconductor apparatus, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2668174