Semiconductor device package having inner leads with slots

Details Semiconductor device package having inner leads with slots Semiconductor device package having inner leads with slots

1997-08-06

1999-03-23

Martin-Wallace, Valencia

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257667, 257674, 257669, H01L 2348, H01L 23495

Patent

active

058864059

ABSTRACT:
A semiconductor device package includes a semiconductor chip and a plurality of inner leads, each having at least one slot formed along an upper surface of the inner lead. An adhesive layer is used to attach a bottom surface of the semiconductor chip to the upper surface of the inner lead. An encapsulant is allowed to flow in a package body mold, around the inner leads and through the slot. The slots prevent the production of turbulence along a side surface of the inner lead opposite to the flow direction, thereby avoiding problems associated with incomplete encapsulation such as the internal voids.

REFERENCES:
patent: 4209355 (1980-06-01), Burns
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5545921 (1996-08-01), Conru et al.
patent: 5623163 (1997-04-01), Izumi

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