4. Plastic article or earthenware shaping or treating: apparatus
  5. Distinct means to feed, support or manipulate preform stock...
  6. Opposed registering coacting female molds

Tae Sung Park

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Mold for semiconductor packages

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent

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Semiconductor device package having inner leads with slots

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Profile ID: LFUS-PAI-P-1576016

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