Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1992-10-26
1994-09-20
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257787, 257788, 257789, 257795, H01L 2328, H01L 2302
Patent
active
053492404
ABSTRACT:
A semiconductor element mounted on a board is sealed with a sealing resin, The semiconductor element is electrically bonded to the board through a soldering bump. The sealing resin includes a silicone gel as a base resin and a filler filled into a silicone gel. A diameter of the filler is equal to or shorter than the distance between the semiconductor element and the board, and a shape of the filler is spherical to improve a thermal conductivity of the sealing resin. The relationship between a coefficient .alpha. of a linear expansion and a complex modulus of elasticity G* of the sealing resin is defined as follows to reduce a force pushing up the semiconductor element:
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Fukuda Yutaka
Narita Ryoichi
Crane Sara W.
Jr. Carl Whitehead
Nippondenso Co. Ltd.
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