Semiconductor device package

Details Semiconductor device package Semiconductor device package

1975-06-30

1976-12-28

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 29590, 357 74, B01J 1700

Patent

active

039992853

ABSTRACT:
A semiconductor device package and a method of making it. A woven fiber mat impregnated with an epoxy adhesive serves as a first housing member. It includes an opening therein for receiving a semiconductor device. The housing member is placed on a supporting heat sink and a lead frame placed on top of the housing member. This subassembly is heated to bond the elements together by curing the epoxy adhesive in the first housing member. A similar second housing member is then placed over the lead frame. The second housing member includes an opening therein which is slightly larger than the opening in the first housing member. A lid is placed on top of the second housing member to cover the opening after the semiconductor device has been bonded to the substrate within the openings in the housing members. The assembly is then again heated to bond the remaining elements together with the epoxy adhesive in the second housing member to form a completed package.

REFERENCES:
patent: 3943623 (1976-03-01), MIzutani

Affiliated with

Also associated with

Rating

Semiconductor device package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-141154