4. Metal working
  5. Method of mechanical manufacture
  6. Assembling or joining

Terrence E. Lewis

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Integrated circuit package incorporating low-stress omnidirectio

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Semiconductor device package

Metal working – Method of mechanical manufacture – Assembling or joining
Patent

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Semiconductor device package

Patent

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Profile ID: LFUS-PAI-P-279597

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