4. Metal working
  5. Method of mechanical manufacture
  6. Assembling or joining

Kenneth N. Abel

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Integrated circuit package having a removable test region for te

Electricity: measuring and testing – Plural – automatically sequential tests
Patent

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Method of removing a soldered integrated circuit package from a

Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent

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Semiconductor device package

Patent

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Semiconductor device package

Metal working – Method of mechanical manufacture – Assembling or joining
Patent

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Profile ID: LFUS-PAI-P-279598

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