Semiconductor device manufactured by a method for attaching a se

Details Semiconductor device manufactured by a method for attaching a se Semiconductor device manufactured by a method for attaching a se

1991-04-19

1992-08-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437220, 357 80, H01L 2158, H01L 2160

Patent

active

051404044

ABSTRACT:
The invention described is directed to a packaged semiconductor chip. As detailed, the invention requires a reduced number of steps to attach a die to a lead frame. The invention uses a carrier material layered on one or two sides with thermoplastic which can be softened to a desired state by the application of heat. By heating the thermoplastic and contacting the die and lead frame, the thermoplastic will bond the die and lead frame to the carrier material, thereby securing the die to the lead frame.

REFERENCES:
patent: 3691289 (1972-09-01), Rohloff
patent: 4012835 (1977-03-01), Wallick
patent: 4812896 (1989-03-01), Rothgery et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 4882298 (1989-11-01), Moeller et al.
patent: 4886200 (1989-12-01), Tsumura
patent: 4924291 (1990-05-01), Lesk et al.
patent: 4934820 (1990-06-01), Takahashi et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4949160 (1990-08-01), Ohno
patent: 4987474 (1991-01-01), Yasuhara et al.
patent: 4989068 (1991-01-01), Yasuhara et al.
patent: 5062565 (1991-11-01), Wood et al.

Affiliated with

Also associated with

Rating

Semiconductor device manufactured by a method for attaching a se does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device manufactured by a method for attaching a se, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device manufactured by a method for attaching a se will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1252783