Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate
2006-09-28
2010-12-07
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With bumps on ends of lead fingers to connect to semiconductor
C257S734000, C257S666000, C257S784000, C257SE23001
Reexamination Certificate
active
07847377
ABSTRACT:
A semiconductor device includes a semiconductor chip having at a center area thereof first and second pad rows which include a plurality of first pads and a plurality of second pads, respectively. A package substrate is bonded to the semiconductor chip. The package substrate includes a substrate opening corresponding to a region including the first and second pad rows, first and second wiring positioned at opposite sides of the substrate opening, respectively, and a ball land disposed in the first wiring area. A bridge section is provided over the substrate opening to mutually connect the first and second wiring areas. The ball land is electrically connected to at least one of the second pads through the bridge section by a lead.
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Isa Satoshi
Katagiri Mitsuaki
Osanai Fumiyuki
Skyles Tifney L
Weiss Howard
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