Semiconductor device including molded wireless exposed drain...

Details Semiconductor device including molded wireless exposed drain... Semiconductor device including molded wireless exposed drain...

2006-01-24

2006-01-24

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S666000

Reexamination Certificate

active

06989588

ABSTRACT:
A semiconductor device including a leadframe and a die coupled thereto. A drain pad is coupled to the drain region of the die in a body that substantially envelopes the leadframe and the die. The body includes a window defined therein. The body is placed around the leadframe and the die such that a surface of the drain pad opposite the die is exposed through the window.

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“Application Notes for Surface Mount Assembly of Amkor's Thermally/Electrically Enhanced Leadframe Based Packages;” Mar. 2000; pp. 1-7; Amkor Technology.
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Data Sheet; ExposedPad™ TSSOP; Mar. 2001; 2 pages; Amkor Technology.

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