Semiconductor device in which semiconductor chip has bottom surf

Details Semiconductor device in which semiconductor chip has bottom surf Semiconductor device in which semiconductor chip has bottom surf

1997-08-28

1998-10-13

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257682, 257784, 438473, H01L 23495

Patent

active

058216138

ABSTRACT:
A method of manufacturing a semiconductor device which includes a semiconductor chip and a plastic package of a thermosetting polymer encapsulating the semiconductor chip through a molding process. The thermosetting polymer of the plastic package fully or partially covers a bottom surface of the semiconductor chip. An ultraviolet cleaning process is performed for cleaning the bottom surface of the semiconductor chip prior to the molding process.

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patent: 4916519 (1990-04-01), Ward
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5233222 (1993-08-01), Djennas et al.
patent: 5264730 (1993-11-01), Matsuzaki et al.
patent: 5302849 (1994-04-01), Cavasin
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5359224 (1994-10-01), Heinen et al.
patent: 5436500 (1995-07-01), Park et al.
patent: 5442231 (1995-08-01), Miyamoto et al.

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