4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Shinichirou Taniguchi

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Method for producing semiconductor device having increased...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Semiconductor device and method of producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent

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Semiconductor device and method of producing the same and semico

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Semiconductor device and method of producing the same and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Semiconductor device having resin gate hole through substrate fo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Profile ID: LFUS-PAI-P-524227

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