Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1993-11-10
1995-02-28
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257435, 257792, 257795, H01L 2328
Patent
active
053940148
ABSTRACT:
In accordance with one aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip which is directly covered with a resin material having a light shielding property as well as a film which is provided on the resin material for shielding the semiconductor device against light. The film may be formed by a seal having a surface which is covered with a metal and a rear surface which is colored black, a layer of a metal or ceramics which is deposited in a vapor phase, or a coating of an insulating material whose refractive index is different from that of the resin material. In another aspect of the present invention, provided is a semiconductor device which is directly covered with a resin material mixed with a light absorbing material. In still another aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip, having a surface covered with black polyimide, which is further covered with a resin material having a light shielding property. In a further aspect of the present invention, provided is a package for covering a semiconductor device which is mounted on a wiring board. According to such improvement, a light shielding property is improved particularly in relation to a thin semiconductor device whose thickness is only about 1 mm, and the semiconductor device is prevented from a malfunction caused by light.
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Hayano Kohji
Ishikawa Masahiko
Mori Shinichi
Moriga Namiki
Ueda Osamu
Limanek Robert P.
Mitsubishi Denki & Kabushiki Kaisha
Potter Roy
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