Semiconductor device having two or more bonding option pads

Details Semiconductor device having two or more bonding option pads Semiconductor device having two or more bonding option pads

1997-05-16

1999-11-09

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257784, 257690, 257691, 257695, H01L 2348, H01L 2352, H01L 2940

Patent

active

059820438

ABSTRACT:
Two or more bonding option pads are aligned in a predetermined direction on a semiconductor chip. Leads on higher and lower potential sides are provided on both sides of the bonding option pads such that the leads are extended in the direction passing across the predetermined direction. At least one of the bonding option pads is connected to at least one of the leads by means of a bonding wire.

REFERENCES:
patent: 5280605 (1994-01-01), Young et al.
patent: 5563443 (1996-10-01), Beng et al.
patent: 5587607 (1996-12-01), Yasuda et al.
patent: 5701031 (1997-12-01), Oguchi et al.

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