Semiconductor device having strain-inducing substrate and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having junction gate

Reexamination Certificate

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C438S191000, C257SE21615

Reexamination Certificate

active

07605031

ABSTRACT:
A semiconductor device includes a semiconductor substrate that includes a substrate layer having a first composition of semiconductor material. A source region, drain region, and a channel region are formed in the substrate, with the drain region spaced apart from the source region and the gate region abutting the channel region. The channel region includes a channel layer having a second composition of semiconductor material. Additionally, the substrate layer abuts the channel layer and applies a stress to the channel region along a boundary between the substrate layer and the channel layer.

REFERENCES:
patent: 5714777 (1998-02-01), Ismail et al.
patent: 6059895 (2000-05-01), Chu et al.
patent: 6251738 (2001-06-01), Huang
patent: 7329909 (2008-02-01), Saito et al.
patent: 2002/0017642 (2002-02-01), Mizushima et al.
patent: 2004/0178406 (2004-09-01), Chu
patent: 2004/0227154 (2004-11-01), Chu et al.
patent: 2006/0054929 (2006-03-01), Nakayama et al.
patent: 2006/0134893 (2006-06-01), Savage et al.
patent: 2006/0163581 (2006-07-01), Suvkhanov
patent: 2007/0096144 (2007-05-01), Kapoor
patent: 2007/0170463 (2007-07-01), Ueno et al.
patent: 2007/0278521 (2007-12-01), Ishida et al.
patent: 2008/0001183 (2008-01-01), Kapoor
patent: 2009/0121775 (2009-05-01), Ueda et al.
USPTO; Office Actionfor U.S. Appl. No. 11/744,660, filed May 4, 2007 in the name of Ashok K. Kapoor; 6 pages, Oct. 31, 2008.
USPTO; Notice of Allowance and Fee(s)Duefor U.S. Appl. No. 11/744,660, filed May 4, 2007 in the name of Ashok K. Kapoor; 5 pages, Feb. 10, 2009.
Matthew T. Currie, 2004 IEEE International Conference on Integrated Circuit Design and Technology,Strained Silicon: Engineered Substrates and Device Integration, pp. 261-268, 2004.
Dielectric and semiconductor materials, devices, and processing—ecs transactions—SiGe and Ge: Materials, Processing, and Devices,ECS Transactions, vol. 3, No. 7, “Strained Si/SiGe Heterostructures on Insulator,” 2006, pp. 9-11, 2006.
PCT Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration with attached International Search Report and Written Opinion of the International Searching Authority in International Application No. PCT/US2008/061198 dated Aug. 6, 2008, 12 pages.

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