Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2006-10-17
2006-10-17
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257SE27104, C257SE27112, C257SE23150, C257SE27101, C257S758000, C257S382000, C257S242000, C257S347000, C257S040000, C257S099000, C257S288000, C257S508000, C257S384000, C257S408000
Reexamination Certificate
active
07122850
ABSTRACT:
A semiconductor device having a local interconnection layer and a method for manufacturing the same are provided. A local interconnection layer is formed in an interlayer dielectric (ILD) layer on an isolation layer and a junction layer, for covering a semiconductor substrate, the isolation layer, and a gate pattern. An etch stopper pattern having at least one layer for preventing the etching of the isolation layer is formed under the local interconnection layer. The etch stopper pattern having at least one layer for preventing the etching of the isolation layer can be included when forming the local interconnection layer, thereby preventing leakage current caused by the etching of the isolation layer, improving the electrical characteristics of a semiconductor device, and improving the yield of a process of manufacturing a semiconductor device.
REFERENCES:
patent: 5536683 (1996-07-01), Lin et al.
patent: 5677231 (1997-10-01), Maniar et al.
patent: 5981331 (1999-11-01), Tsunemine
patent: 6046103 (2000-04-01), Thei et al.
patent: 6080616 (2000-06-01), Kim
patent: 6133105 (2000-10-01), Chen et al.
patent: 6180532 (2001-01-01), Yang et al.
patent: 6204106 (2001-03-01), Gonzalez
patent: 6207539 (2001-03-01), Natsume
patent: 6207543 (2001-03-01), Harvey et al.
patent: 6222254 (2001-04-01), Liang et al.
patent: 6249014 (2001-06-01), Bailey
patent: 6251724 (2001-06-01), Ku et al.
patent: 6300229 (2001-10-01), Tanaka et al.
patent: 6313510 (2001-11-01), Kim et al.
patent: 6335249 (2002-01-01), Thei et al.
patent: 6344692 (2002-02-01), Ikemasu et al.
patent: 6352903 (2002-03-01), Rovedo et al.
patent: 6486077 (2002-11-01), Sato
patent: 6498088 (2002-12-01), Trivedi
patent: 6531724 (2003-03-01), Furukawa et al.
patent: 6551901 (2003-04-01), Gu et al.
patent: 6555892 (2003-04-01), Horstmann et al.
patent: 6597055 (2003-07-01), Liaw
patent: 6613645 (2003-09-01), Fukaura
patent: 6649490 (2003-11-01), Lee et al.
patent: 6710413 (2004-03-01), Thei et al.
patent: 6735108 (2004-05-01), Kurth et al.
patent: 6781867 (2004-08-01), Kurth et al.
patent: 6791131 (2004-09-01), Fazan et al.
patent: 6818489 (2004-11-01), Kim et al.
patent: 2001/0001075 (2001-05-01), Ngo et al.
patent: 2001/0010961 (2001-08-01), Jung et al.
patent: 2002/0053694 (2002-05-01), Sutcliffe
patent: 2002/0058402 (2002-05-01), Wieczorek et al.
patent: 2002/0132191 (2002-09-01), Chuang
patent: 2002/0158272 (2002-10-01), Natsume
patent: 2003/0113973 (2003-06-01), Chu
patent: 2003/0124845 (2003-07-01), Trivedi
patent: 2005/0037569 (2005-02-01), Itoh
patent: 00-0040447 (2000-05-01), None
Ji Hyung-tae
Nam Dong-kyun
Shin Heon-jong
Mills & Onello LLP
Samsung Electronics Co,. Ltd.
Williams Alexander Oscar
LandOfFree
Semiconductor device having local interconnection layer and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having local interconnection layer and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having local interconnection layer and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3710528