Semiconductor device having lead on chip structure

Details Semiconductor device having lead on chip structure Semiconductor device having lead on chip structure

1996-09-20

1999-12-14

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257723, 257673, 257666, 257686, 257730, H01L 23495, H01L 2348, H01L 2352

Patent

active

060021675

ABSTRACT:
A semiconductor device has a semi-conductor chip 1 having bonding pads 2 thereon, conductive leads 4, each of which comprises an inner lead 41 and an outer lead 42, insulating adhesive tapes 3 by which each of the inner leads 41 of the leads 4 is stuck to the surface 1a of the semiconductor chip 1, bonding wires 6 by which each of the leads 4 is electrically connected to each corresponding bonding pad 2. The semiconductor chip 1, bonding pad 2, adhesive tapes 3, inner leads 41, and bonding wires 6 are molded by a molding resin 5. The boundary of the inner lead 41 and the cuter lead 42 of the lead 4 is bent in S-shape so that there is a step between inner lead 41 and the upper side portion 42a of the outer lead 42 in a certain depth. Then the outer lead 42 protrude out of the molding resin and extend in J-shape. The surface 4a of the upper side portion 42a of the outer lead 42 is higher than the top of the looped bonding wire 6.

REFERENCES:
patent: 5530286 (1996-06-01), Murakami et al.
patent: 5554886 (1996-09-01), Song
patent: 5760471 (1998-06-01), Fujisawa et al.

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