Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1991-08-26
1993-11-02
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257687, 257787, 257798, 174257, 174258, H01L 2328, H01L 2302, H01L 2312, H01B 1700
Patent
active
052586502
ABSTRACT:
In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bonds (27), connect the semiconductor device to conductor paths (28) on the base within the cavity. An encapsulation material comprising a thixotropic fluorosiloxane material (51; 61) is applied in the cavity and completely covers the semiconductor device and the electrical connections. This structure enables the semiconductor device to withstand typical automotive contaminants, such as mild acids and gasoline, while also preventing erratic semiconductor device operation due to bubbles which may be drawn into the encapsulation material.
REFERENCES:
patent: Re31967 (1985-08-01), Burns
patent: 4063993 (1977-12-01), Burns
patent: 4829014 (1989-05-01), Yerman
patent: 5099090 (1992-03-01), Allan et al.
Cab-O-Sil Fumed Silica in Adhesives and Sealants Catalog.
Polak Anthony J.
Schifferle David J.
Wang Tom
Jackson Jerome
Jr. Carl Whitehead
Melamed Phillip H.
Moore John H.
Motorola Inc.
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