Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2006-05-23
2006-05-23
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C706S032000, C706S032000, C706S032000, C706S032000, C706S032000, C706S032000, C706S032000
Reexamination Certificate
active
07049688
ABSTRACT:
A semiconductor device includes a heater element; a first heat sink disposed on one side of the heater element; a second heat sink disposed on the other side of the heater element; and a resin mold for molding the heater element and the first and second heat sinks. The first heat sink includes a first heat radiation surface, which is disposed opposite to the heater element and exposed from the resin mold. The second heat sink includes a second heat radiation surface, which is disposed opposite to the heater element and exposed from the resin mold. The first and second heat radiation surfaces have a degree of parallelism therebetween equal to or smaller than 0.2 mm.
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Nakazawa Shusaku
Teshima Takanori
Clark Jasmine
Denso Corporation
Posz Law Group , PLC
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