Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1998-06-05
2000-03-07
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257782, H01L 2348, H01L 2352, H01L 2940
Patent
active
060344377
ABSTRACT:
A semiconductor device includes a semiconductor chip and an intermediary buffer board attached to the chip. The chip includes a plurality of electrode pads on the semiconductor chip, an insulating member formed on the mounting surface of the semiconductor chip, a conductor pattern formed on the insulating member and electrically connected to the electrode pads, and a plurality of first terminals provided on the insulating member in electrical connection to the conductor pattern. The buffer board has a plurality of second terminals provided in corresponding relationship to the first terminals in electrical connection thereto.
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patent: 5844304 (1998-12-01), Kata et al.
patent: 5886409 (1999-03-01), Ishino et al.
patent: 5886415 (1999-03-01), Akagawa
Clark Sheila V.
Rohm & Co., Ltd.
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